- Commodity name: Triple lon-beam milling systems Leica EM TIC 3X
The Leica EM TIC 3X triple ion beam cutter can prepare transverse sections and polished surfaces for scanning electron microscopy (SEM), microstructure analysis (EDS, WDS, Auger, EBSD) and AFM research work. With Leica EM TIX 3X, you can achieve a high-quality surface treatment of almost any material at room temperature or freezing, showing the internal structure of the sample as close to its natural state as possible.

● Compared to the previous version, the new version not only doubles the cutting speed, its unique three-ion beam system also optimizes the preparation quality and reduces the working time. Up to 3 samples can be processed at a time and can be cross-cut and polished on the same stage. Workflow solutions for safe sample transfer to subsequent preparation instruments or analytical systems.

With its flexible stage, the Leica EM TIC 3X is ideal not only for high-throughput processing, but also for laboratories that commission tests. Depending on your needs, the Leica EM TIC 3X can be personalized with the following interchangeable stage options: Standard stage, multi-sample stage, rotary stage, cooled stage or vacuum frozen transfer dock for the preparation of standard samples, high yield processing, and at low temperatures for the preparation of samples that are extremely sensitive to high temperatures, such as polymers, rubber or biomaterials.

With the VCT docking station interface with the Leica EM TIC 3X, you can provide a plane workflow for environmentally sensitive samples and/or low-temperature samples, such as biological, geological or industrial materials. These samples are then transferred under inert gas/vacuum/freezing conditions to our coating systems EM ACE600 or EM ACE900 and/or SEM systems.